Jet Soldering
Jet Soldering for PCBs: Precision Paste Deposition Without Compromise
Jet soldering is a high-speed, non-contact method for applying solder paste with exceptional accuracy. This technology is ideal for printed circuit boards that feature fine-pitch components, irregular surfaces, or require selective soldering without the need for custom stencils.
Jet soldering supports rapid prototyping, low- to mid-volume production, and advanced assemblies where flexibility and precision are critical. It enables engineers to adjust paste volume and placement dynamically, improving consistency and reducing waste.
Benefits of Jet Soldering
No stencil required, reducing setup time and cost
High placement accuracy for fine-pitch and micro components
Adjustable dot size and volume for tailored soldering
Ideal for boards with uneven surfaces or mixed technologies
Supports fast design iterations and engineering changes
Jet Soldering is Well Suited for
Prototype builds with frequent revisions
High-density layouts with tight spacing
Assemblies requiring selective solder paste deposition
Boards with 3D components or non-planar surfaces
Mixed SMT and through-hole designs
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Why Choose Caltronics?
Jet soldering enhances process control and repeatability, especially in environments where traditional stencil printing is not feasible. It supports complex board designs and helps reduce defects by ensuring consistent solder paste application. Ready to learn more or get started today? Caltronics is ready to help!
Get Started with Caltronics Today
Ready to turn your innovative ideas into reality? Fill out the form below or call us at 651.462.1440 to learn how we can assist you in achieving your goals.
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