Jet Soldering

Jet Soldering for PCBs: Precision Paste Deposition Without Compromise

Jet soldering is a high-speed, non-contact method for applying solder paste with exceptional accuracy. This technology is ideal for printed circuit boards that feature fine-pitch components, irregular surfaces, or require selective soldering without the need for custom stencils. 

Jet soldering supports rapid prototyping, low- to mid-volume production, and advanced assemblies where flexibility and precision are critical. It enables engineers to adjust paste volume and placement dynamically, improving consistency and reducing waste.  

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Benefits of Jet Soldering

  • No stencil required, reducing setup time and cost 

  • High placement accuracy for fine-pitch and micro components 

  • Adjustable dot size and volume for tailored soldering 

  • Ideal for boards with uneven surfaces or mixed technologies 

  • Supports fast design iterations and engineering changes  

Jet Soldering is Well Suited for  

  • Prototype builds with frequent revisions 

  • High-density layouts with tight spacing 

  • Assemblies requiring selective solder paste deposition 

  • Boards with 3D components or non-planar surfaces 

  • Mixed SMT and through-hole designs 

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Why Choose Caltronics?

Jet soldering enhances process control and repeatability, especially in environments where traditional stencil printing is not feasible. It supports complex board designs and helps reduce defects by ensuring consistent solder paste application. Ready to learn more or get started today? Caltronics is ready to help!   

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